We provide innovation technologies to make the life better.
Since 2003, in the field of Surface-Mount Technology (SMT), we have mass-produced a diverse range of mixed-size components (from 0402 chips to 88mm odd-shaped materials, Stick (bulk), Tray ICs, etc.), applied lead-free production capabilities and reliability assessments. In the IMT sector, we have ensured customer quality and reliability through Wave Soldering, In-Circuit Testing (ICT), Functional Circuit Testing (FCT), coating, firmware inspection, aging tests, and thermal shock assessment. For the growth of the SMT technology sector, we are actively expanding our micro-assembly technology (0201 Chip, 0.3mm Ball) and mixed assembly techniques. We are committed to providing global solutions by integrating Smart Factory, automation, and robotics technologies.
Securing mass production capabilities through optimal management of printing, placement, and curing conditions on ceramic substrates, along with traceability and timely inspection management system, ensuring reliability through shear and thermal shock assessments, operating a Clean Room (class 3,000), and obtaining water-soluble solder printing, placement, and cleaning technologies for semiconductor and medical device cleaning; moreover, we pursue a One Stop Service through SMT, IMT, ICT, FCT, coating, aging, and assembly processes.
SMT, IMT Business Expansion
Total Poduct Quantity
Manufacturing of internal circuit boards for digital TVs that provide high-
definition images, large screens, and smart features, used in home,
commercial, and educational institution TVs, including SMT, IMT, and
assembly
Printing and placement technology for various mixed components from 0402 chips to 66mm irregular materials, bulk (Stick), Tray parts, etc.
Ensuring customer quality through AOI, FCT, Rom Verify processes
Completion of lead (Pb) to lead-free (Pb-Free) mass production validation since 2003
Securing customer quality and reliability through Wave Soldering, ICT, performance testing, and placement inspection
Y-Drive + Y-sus
Control
Z-sus
XC / XL / XR
External inspection process based on the inspection standard concerted to satisfy the customer’s high level of quality
A process of inserting components (Pin Type) into circuit board holes used in electronic product manufacturing
The process of soldering the pins of through-hole components to the holes in the circuit board
A process that checks for proper soldering after Wave Soldering and re-solders any insufficient areas
A process to test the accuracy of components and circuits embedded in the circuit board, connection status of components, and their electrical operation
A testing process conducted in the final stage of electronic product manufacturing to verify that the manufactured products meet design specifications and function properly
A process of automatically applying silicone on the leads of certain ICs and connectors to prevent electrical shorts
A process of appearance inspection based on agreed inspection standards to satisfy high customer quality levels
The process of assembling the final product using various boards, connection cables, screws, tapes, and parts for combination, connection, heat dissipation, Rom Verify, etc.
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