We provide innovation technologies to make the energy better.
Since 2003, in the field of Surface-Mount Technology (SMT), we have mass-produced a diverse range of mixed-size components (from 0402 chips to 88mm odd-shaped materials, Stick (bulk), Tray ICs, etc.), applied lead-free production capabilities and reliability assessments. In the IMT sector, we have ensured customer quality and reliability through Wave Soldering, In-Circuit Testing (ICT), Functional Circuit Testing (FCT), coating, firmware inspection, aging tests, and thermal shock assessment. For the growth of the SMT technology sector, we are actively expanding our micro-assembly technology (0201 Chip, 0.3mm Ball) and mixed assembly techniques. We are committed to providing global solutions by integrating Smart Factory, automation, and robotics technologies.
Securing mass production capabilities through optimal management of printing, placement, and curing conditions on ceramic substrates, along with traceability and timely inspection management system, ensuring reliability through shear and thermal shock assessments, operating a Clean Room (class 3,000), and obtaining water-soluble solder printing, placement, and cleaning technologies for semiconductor and medical device cleaning; moreover, we pursue a One Stop Service through SMT, IMT, ICT, FCT, coating, aging, and assembly processes.
SMT, IMT Business Expansion
Total Poduct Quantity
Modules that convert direct current produced by solar power
systems into alternating current are delivered through Main B/D SMT,
IMT, assembly, and aging tests.
The top side is the SMT process. The bottom side is joined by wave soldering after the chip bonding process.
A 20-year quality guarantee through ICT, performance testing and Rom Verify, coating, and aging processes.
Solar Inverter
Solar Module
Installation
Electrical Usage
in Home Appliances
(Refrigerators,
Washing Machines, etc.)
A process of inserting components (Pin Type) into circuit board holes used in electronic product manufacturing
The process of soldering the pins of through-hole components to the holes in the circuit board
A process to test the accuracy of components and circuits embedded in the circuit board, connection status of components, and their electrical operation
A testing process conducted in the final stage of electronic product manufacturing to verify that the manufactured products meet design specifications and function properly
The process of assembling the final product using various boards, connection cables, screws, tapes, and parts for combination, connection, heat dissipation, Rom Verify, etc.
Assessing the stability and long-term reliability of the final assembled product over a certain period
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