K&P

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We grow with global companies.

We are the manufacturer that the world's best mobile companies trust.

With the dedication
of nurturing a bloom,

we put our utmost effort into every product we create.

To provide higher value to our customers, we ceaselessly challenge and innovate.

We create a stable foundation for our employees' families by securing corporate competitiveness with the best service and quality for our customers.

The technological expertise of K&P Co., Ltd.
leads the future of SMT.

Camera / 3D Sensing
Module

We produce camera and 3D sensing modules, using 0402 Chips and 0.3mm BGA Balls on ceramic substrates, providing high- quality products with QR code tracking and reliability reviews.

Auotomotive LED

We produce LED Arrays for automotive infotainment (BLU), equipped with various technologies and certifications to ensure quality, and enhance reliability through standard compliance.

Package Substrate

FC-BGA is a sophisticated technology used for large, multi- layered, high-density circuit boards, applicable to CPU/GPU, base station processors, Switch Chips, ADAS Chipsets, and more. FC-CSP is a high-density circuit board used in various applications, such as mobile devices and computers.

Solar Inverter Module

We insert through-hole components and join them with Wave Soldering, offering superior quality and reliability, achieving a 20-year quality guarantee through ICT, FCT and Rom Verify, coating, and aging processes.

TV Module

We manufacture Control, X, Y-Drive, Y-sus, and Z-sus B/D necessary for TV operation and possess mass production capabilities with various mixed-sized components. We ensure customer quality and reliability through production and assembly inspection.