We provide innovation technologies to make the world better.

Package Substrate

SMT

K&P Co., Ltd. provides the best service
with our unique technical expertise.

Since 2003, in the field of Surface-Mount Technology (SMT), we have mass-produced a diverse range of mixed-size components (from 0402 chips to 88mm odd-shaped materials, Stick (bulk), Tray ICs, etc.), applied lead-free production capabilities and reliability assessments. In the IMT sector, we have ensured customer quality and reliability through Wave Soldering, In-Circuit Testing (ICT), Functional Circuit Testing (FCT), coating, firmware inspection, aging tests, and thermal shock assessment. For the growth of the SMT technology sector, we are actively expanding our micro-assembly technology (0201 Chip, 0.3mm Ball) and mixed assembly techniques. We are committed to providing global solutions by integrating Smart Factory, automation, and robotics technologies.

Leveraging our solid mass production experience in mobile cameras, 3D sensing modules, TVs, solar panels, and network repeaters, we manufacture SMT with differentiated technical process.

Securing mass production capabilities through optimal management of printing, placement, and curing conditions on ceramic substrates, along with traceability and timely inspection management system, ensuring reliability through shear and thermal shock assessments, operating a Clean Room (class 3,000), and obtaining water-soluble solder printing, placement, and cleaning technologies for semiconductor and medical device cleaning; moreover, we pursue a One Stop Service through SMT, IMT, ICT, FCT, coating, aging, and assembly processes.

FC-BGA: A large, multilayered, high-density circuit board applied to
CPU/GPU, base station processors, switch chips, ADAS chipsets,
and more.
FC-CSP: A high-density circuit board used in various
applications, such as mobile devices and computers.

Core Competencies

Mastery of technology to print, place, and join 1005 Chip, 0603 Chip directly on the substrate with the semiconductor using Bump Pads for direct packaging.

Operation of Clean Rooms for reliability assurance, as well as component shear strength measurement and thermal shock testing.

PRODUCT APPLICATION

Automobile (ADAS Chipset)

AI/Server/PC (CPU)

Smart Phone
(AP core components)

AI/Server/PC (GPU)

PROCESS

01. Screen Printer

The process of printing solder paste in precise locations and volumes on the PCB electronic board pads

02. SPI

The process of inspecting and determining the position (X, Y) and volume (Volume, Height) of the solder paste printed on the PCB electronic board pads

03. Mount

The process of mounting electronic components (Cap, Resistor, IC, etc.) quickly and precisely at predetermined locations (X, Y, Th) on the printed PCB electronic board

04. Reflow

A process that joins electronic components and PCBs through the melting and curing of solder paste.

05. AOI

An automated optical inspection process that scans with an LED light source to evaluate the mounting and soldering state of electronic components against inspection standards.

06. Visual Inspection

A visual inspection process based on agreed standards to meet customers' high-quality levels.

07.Shipping/Packaging

A process of product packaging and issuing shipping certificates in accordance with packaging standards agreed with customers.

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